Welcome kit with conference material
Venue
Frankfurt, Germany
The World Conference
Semiconductors & Microchips
- 28-30 April, 2026
- Milan, Italy
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About the Event
Semiconductors & AI
Will be held in Frankfurt, Germany, the Semiconductor and AI Summit serves as a premier global platform for showcasing advancements in chip design, manufacturing, and cutting-edge applications. This event theme is "AI-Driven Workloads & Chiplets" and dedicated to driving innovation while addressing key challenges such as sustainability and supply chain resilience. With a spotlight on transformative technologies like AI, IoT, and 6G, the conference offers attendees an unparalleled opportunity to engage with industry leaders, present ground breaking solutions, and collaborate on shaping a smarter, more connected future.
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Events Highilights
Pioneering Next-Generation
This conference will highlight advancements in semiconductor and microchip technologies, focusing on AI, 6G, autonomous systems, and smart manufacturing. It aims to bring industry leaders together to explore breakthroughs that will drive innovation, shape the future of industries, and enhance system efficiency.
The Future of Automobiles
Modern vehicles rely on intelligent sensors, high-performance microchips, and AI accelerators to enable ADAS, autonomous driving, electrification, and connected mobility. This event unites automotive OEMs, Tier-1 suppliers, and chip innovators to explore next-generation automotive semiconductors, sensor fusion, edge AI, functional safety, and secure in-vehicle computing solutions.
Building Global Networks
This event fosters global collaboration in the semiconductor ecosystem, connecting key players from research, design, manufacturing, and application sectors to drive innovation, strategic partnerships, and cross-border dialogue, ensuring a more integrated and resilient supply chain for the future.
Key Attendees?
CEO / Founder – Semiconductor or Fabless Company
AI Accelerator / Edge AI Chip Architect
Semiconductor-Focused VC / Corporate Venture Leader
President / COO – Foundry or OSAT Provider
CTO / Chief Scientist – Major Chip Manufacturer
Director of Device Engineering
Supply Chain Director – Semiconductor Materials
Director of Verification & DFT
Government Semiconductor Mission / Policy Head
Event Takeaways
Future of AI-Driven Semiconductors – Insights into how AI accelerators, edge computing, and advanced microchips are reshaping automotive, IoT, and data-center innovation.
Advanced Packaging & Manufacturing – Latest developments in chiplet architectures, heterogeneous integration, and next-generation process technologies.
Design, Verification & EDA Evolution – New methodologies in SoC design, DFT, and hardware architecture to meet performance and power demands.
Supply Chain Resilience – Strategies to secure materials, equipment, and capacity across foundry, OSAT, and fab ecosystems.
Investment & Policy Direction – Perspectives from governments and investors on funding, incentives, and global semiconductor growth opportunities.
Featured Topics
Semiconductors and Microelectronics
Semiconductors and Microelectronics
Innovating at the atomic level, semiconductors and microelectronics lay the groundwork for the technologies of tomorrow, revolutionizing industries and enhancing lives across the globe.
AI‑Powered Self‑Driving Labs for Chip Innovation
AI‑Powered Self‑Driving Labs for Chip Innovation
Explore autonomous laboratories that combine AI, robotics and high‑throughput experimentation to accelerate semiconductor materials discovery, process optimisation and next‑generation chip innovation.
Next‑Gen Chip Architectures for Edge AI & TinyML
Next‑Gen Chip Architectures for Edge AI & TinyML
Discover ultra‑efficient architectures, neuromorphic designs and TinyML accelerators enabling real‑time intelligence on constrained devices at the network edge, from wearables to industrial sensors.
Chips, Geopolitics & Resilient Global Supply Chains
Chips, Geopolitics & Resilient Global Supply Chains
Examine how industrial policy, export controls and regional alliances reshape semiconductor supply chains, and strategies manufacturers use to manage risk, localisation and resilience.
Smart Fabs 4.0: Digital Twins, Robotics & Automation
Smart Fabs 4.0: Digital Twins, Robotics & Automation
See how digital twins, predictive analytics and robotics transform fabs into fully connected, self‑optimising manufacturing environments improving yield, throughput, quality.
Learn More about other important Topics
Learn More about other important Topics
This section invites further exploration of essential subjects related to health, nutrition, and safety, encouraging a deeper understanding of their impact on well-being and informed decision-making.
More About
Ticket Pricing
Book Your Seat Now
Speaker
€599
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Access to All Talks + Parallel Session
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Opportunity to deliver an oral presentation
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Certificate of Presenter with CPD credits
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Access to all Delegate List
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Exclusive VIP networking Lunch-on
Delegate
€699
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Welcome kit with conference material
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Access to All Talks + Parallel Session
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Opportunity to schedule F2F meeting with decision makers
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Logo placement on Conference Website
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Certificate of Participation
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Copy of Event magazine/book with participants list
Student
€499
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Welcome kit with conference material
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Access to All Talks + Parallel Session
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Opportunity to deliver a poster presentation
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Certificate of Presenter with CPD credits
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Networking Lunch with Delegate and Speakers
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Access to Schedule F2F meeting
Event Schedule
Follow Events Schedule
- 10:55 AM – 12:30 PM
Session 1
AI‑Driven Materials Discovery & Self‑Driving Labs | Next‑ Generation Semiconductor Materials for Green Energy & Power Electronics
Autonomous labs for semiconductor materials, thin films and nanostructures; AI‑robotics
closed‑loop experimentation for faster discovery and optimisation. SiC, GaN, and other
wide‑bandgap materials for EVs, renewables and high‑efficiency power systems.
- 02:05 PM – 03:10 PM
Session 2
Advanced Chip Architectures for Edge AI & TinyML | Heterogeneous Integration, 3D Packaging & Chiplets
Neuromorphic, in‑memory and low‑power ML accelerators for on‑device learning and edge
intelligence. 2.5D/3D integration, chiplet ecosystems, advanced packaging for high‑bandwidth
computing and AI data centers.
- 04:45 PM – 06:00 PM
Session 3
AI & Robotics for Organ‑on‑Chip and Multi‑Organ‑Chip Platforms | Flexible, Printed and Neuromorphic Electronics for New Applications
Using AI and robotic systems to run high‑throughput experiments on organ‑on‑chip devices, linking
semiconductors/micro‑fluidics with preclinical testing. Printed and flexible chips, sensors and
neuromorphic hardware for wearables, smart packaging and bio‑interfaces.
- 10:55 AM – 12:30 PM
Session 1
Industry 4.0: Smart Fabs, Digital Twins & Automation | Secure & Trustworthy Chips for Automotive, Aerospace and Critical Infrastructure
Fully automated fabs, robotics, predictive maintenance, digital twins and data platforms for
yield, throughput and quality. Functional safety, hardware security, reliability and certification
for autonomous vehicles, aviation, and defense systems.
- 02:05 PM – 03:10 PM
Session 2
Sustainable Semiconductor Manufacturing & Critical Materials | Resilient Global Supply Chains & Geopolitics of Chips
PFAS‑free chemistries, low‑GWP etch gases, water and energy reduction, circularity for wafers,
and critical‑materials security. CHIPS‑style policies, regional alliances, friend‑shoring, and risk
management across the semiconductor and robotics supply chains.
- 04:45 PM – 06:00 PM
Session 3
AI‑Enhanced EDA, Verification & Design Automation | Startup & Innovation Showcase: From Lab to Fab to Market
Generative AI and reinforcement learning for EDA tools, verification, layout, and test
optimisation. Pitches and case studies from early‑stage semiconductor, robotics and
organ‑on‑chip startups; collaboration with large manufacturers.
Get in there to Reach
Get Direction to the
Event Hall
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Address
Shall be updated soon..
Detail
Name: Mr. Singh
Phone:+44 1442948308
Time
Mon – Sat: 8:00 am to 6:00 pm