


This conference will highlight advancements in semiconductor and microchip technologies, focusing on AI, 6G, autonomous systems, and smart manufacturing. It aims to bring industry leaders together to explore breakthroughs that will drive innovation, shape the future of industries, and enhance system efficiency.

Modern vehicles rely on intelligent sensors, high-performance microchips, and AI accelerators to enable ADAS, autonomous driving, electrification, and connected mobility. This event unites automotive OEMs, Tier-1 suppliers, and chip innovators to explore next-generation automotive semiconductors, sensor fusion, edge AI, functional safety, and secure in-vehicle computing solutions.

This event fosters global collaboration in the semiconductor ecosystem, connecting key players from research, design, manufacturing, and application sectors to drive innovation, strategic partnerships, and cross-border dialogue, ensuring a more integrated and resilient supply chain for the future.
CEO / Founder – Semiconductor or Fabless Company
AI Accelerator / Edge AI Chip Architect
Semiconductor-Focused VC / Corporate Venture Leader
President / COO – Foundry or OSAT Provider
CTO / Chief Scientist – Major Chip Manufacturer
Director of Device Engineering
Supply Chain Director – Semiconductor Materials
Director of Verification & DFT
Government Semiconductor Mission / Policy Head
Future of AI-Driven Semiconductors – Insights into how AI accelerators, edge computing, and advanced microchips are reshaping automotive, IoT, and data-center innovation.
Advanced Packaging & Manufacturing – Latest developments in chiplet architectures, heterogeneous integration, and next-generation process technologies.
Design, Verification & EDA Evolution – New methodologies in SoC design, DFT, and hardware architecture to meet performance and power demands.
Supply Chain Resilience – Strategies to secure materials, equipment, and capacity across foundry, OSAT, and fab ecosystems.
Investment & Policy Direction – Perspectives from governments and investors on funding, incentives, and global semiconductor growth opportunities.
Autonomous labs for semiconductor materials, thin films and nanostructures; AI‑robotics closed‑loop experimentation for faster discovery and optimisation. SiC, GaN, and other wide‑bandgap materials for EVs, renewables and high‑efficiency power systems.
Neuromorphic, in‑memory and low‑power ML accelerators for on‑device learning and edge intelligence. 2.5D/3D integration, chiplet ecosystems, advanced packaging for high‑bandwidth computing and AI data centers.
Using AI and robotic systems to run high‑throughput experiments on organ‑on‑chip devices, linking semiconductors/micro‑fluidics with preclinical testing. Printed and flexible chips, sensors and neuromorphic hardware for wearables, smart packaging and bio‑interfaces.
Fully automated fabs, robotics, predictive maintenance, digital twins and data platforms for yield, throughput and quality. Functional safety, hardware security, reliability and certification for autonomous vehicles, aviation, and defense systems.
PFAS‑free chemistries, low‑GWP etch gases, water and energy reduction, circularity for wafers, and critical‑materials security. CHIPS‑style policies, regional alliances, friend‑shoring, and risk management across the semiconductor and robotics supply chains.
Generative AI and reinforcement learning for EDA tools, verification, layout, and test optimisation. Pitches and case studies from early‑stage semiconductor, robotics and organ‑on‑chip startups; collaboration with large manufacturers.