Abstract Submission

Autonomous labs for semiconductor materials, thin films and nanostructures; AI‑robotics closed‑loop experimentation for faster discovery and optimisation.

Neuromorphic, in‑memory and low‑power ML accelerators for on‑device learning and edge intelligence.

2.5D/3D integration, quantum accelerators, chiplet ecosystems, advanced packaging for high‑bandwidth computing and AI data centers.

Using AI and robotic systems to run high‑throughput experiments on organ‑on‑chip devices, linking semiconductors/micro‑fluidics with preclinical testing.

Printed and flexible chips, sensors and neuromorphic hardware for wearables, smart packaging and bio‑interfaces.

Fully automated fabs, robotics, predictive maintenance, digital twins and data platforms for yield, throughput and quality.

Functional safety, hardware security, reliability and certification for autonomous vehicles, aviation, and defense systems.

PFAS‑free chemistries, low‑GWP etch gases, water and energy reduction, circularity for wafers, and critical‑materials security.

CHIPS‑style policies, regional alliances, friend‑shoring, and risk management across the semiconductor and robotics supply chains.

Generative AI and reinforcement learning for EDA tools, verification, layout, and test optimisation.

Pitches and case studies from early‑stage semiconductor, robotics and organ‑on‑chip startups; collaboration with large manufacturers.